JPH0215588Y2 - - Google Patents

Info

Publication number
JPH0215588Y2
JPH0215588Y2 JP1983027093U JP2709383U JPH0215588Y2 JP H0215588 Y2 JPH0215588 Y2 JP H0215588Y2 JP 1983027093 U JP1983027093 U JP 1983027093U JP 2709383 U JP2709383 U JP 2709383U JP H0215588 Y2 JPH0215588 Y2 JP H0215588Y2
Authority
JP
Japan
Prior art keywords
pressure
dispensing
solenoid valve
gas
dispensing nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983027093U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59135170U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2709383U priority Critical patent/JPS59135170U/ja
Publication of JPS59135170U publication Critical patent/JPS59135170U/ja
Application granted granted Critical
Publication of JPH0215588Y2 publication Critical patent/JPH0215588Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
JP2709383U 1983-02-28 1983-02-28 超精密用デイスペンサ− Granted JPS59135170U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2709383U JPS59135170U (ja) 1983-02-28 1983-02-28 超精密用デイスペンサ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2709383U JPS59135170U (ja) 1983-02-28 1983-02-28 超精密用デイスペンサ−

Publications (2)

Publication Number Publication Date
JPS59135170U JPS59135170U (ja) 1984-09-10
JPH0215588Y2 true JPH0215588Y2 (en]) 1990-04-26

Family

ID=30157988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2709383U Granted JPS59135170U (ja) 1983-02-28 1983-02-28 超精密用デイスペンサ−

Country Status (1)

Country Link
JP (1) JPS59135170U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140607A1 (ja) * 2009-06-03 2010-12-09 武蔵エンジニアリング株式会社 液体定量吐出方法および装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5666278B2 (ja) * 2010-12-14 2015-02-12 キヤノンマシナリー株式会社 液体供給装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020447Y2 (ja) * 1980-12-02 1985-06-19 パイオニア株式会社 接着剤塗布装置
JPS57161465U (en]) * 1981-04-02 1982-10-09

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010140607A1 (ja) * 2009-06-03 2010-12-09 武蔵エンジニアリング株式会社 液体定量吐出方法および装置
JP2010279867A (ja) * 2009-06-03 2010-12-16 Musashi Eng Co Ltd 液体定量吐出方法および装置
US8770439B2 (en) 2009-06-03 2014-07-08 Musashi Engineering, Inc. Method and device for discharging a fixed amount of liquid
EP2438998A4 (en) * 2009-06-03 2017-11-08 Musashi Engineering, Inc. Method and device for discharging a fixed amount of liquid

Also Published As

Publication number Publication date
JPS59135170U (ja) 1984-09-10

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